DSIO Interface Module ikoreshwa mu gupima imikoranire mu buryo butaziguye hamwe na chip-level interfaces

Moduli ya DSIO y’uruhererekane rw’ikoranabuhanga ni module ikoreshwa mu gupima itumanaho ry’amakuru hakoreshejwe uburyo bwa chip-level, nka I²S. Byongeye kandi, module ya DSIO ishyigikira TDM cyangwa uburyo bwinshi bwo gushyiraho imirongo y’amakuru, ikora imirongo 8 y’amajwi.

Moduli ya DSIO ni inyongera y’igikoresho cy’amajwi, gikoreshwa mu kwagura uburyo bwo gupima n’imikorere yacyo.